We engineer the greases, pads, gap fillers and tapes that keep EV batteries, electronics and power systems running cool — backed by hands-on application support and India-based stock.
Zyrmet is an India-based advanced materials company focused exclusively on thermal interface solutions — the greases, pads, gap fillers, tapes and encapsulants that keep today's electronics, batteries and power systems running cool, reliable and long-lived.
We combine hands-on application engineering with a qualified, multi-region supply network so customers get the right material, in the right form factor, on a schedule that matches Indian manufacturing timelines — not import lead times.
To make dependable, application-engineered thermal management materials readily available to every Indian manufacturer — from a first-time EV battery line to an established defence electronics program.
Every material recommendation is backed by engineering, not a catalogue lookup.
Hands-on material selection and application engineering for every design challenge, from first sample to production ramp.
A qualified network of material technologies spanning Asia, Europe and the US, so no single-source risk sits on your BOM.
Fast sampling and technical response so development programs are never held up waiting on materials.
Form factors and grades matched to the application, not generic off-the-shelf compromises.
Consistent quality and on-time delivery from India-based stock, backed by redundant sourcing routes.
Every batch verified against thermal, electrical and mechanical specification before it ships.
From first-run EV battery lines to certified defence electronics programs.
Cell-to-module gap filling and pack-level thermal management for battery and drivetrain manufacturers.
Grease, pads and tapes for processors, power ICs and board-level thermal paths.
Adhesive tapes and gap pads that move heat from chip to heat sink in high-volume luminaire production.
Conformable, low-stress pads for radio units and base-station electronics.
Insulating and conductive materials for drives, inverters and power supplies.
Certified, high-reliability materials for radar, avionics and communication systems.
Every family is available in multiple grades, engineered to the application rather than sold off the shelf.
| Application Need | Recommended Family | Key Spec to Verify | Why This Family |
|---|---|---|---|
| Flat CPU / power module to heat sink, thin bond line | ZT-G Thermal Grease | TC + bleed resistance | Best contact on flat, low-tolerance surfaces |
| EV battery cell-to-module gap, large clearance | ZT-F Gap Filler | TC + dispensed viscosity | Fills irregular geometry via automated dispensing |
| CPU / GPU replacing grease, no pump-out risk | ZT-C Phase Change | Phase transition temp | Solid at rest, flows only under operating heat |
| LED chip to heat sink, light mechanical load | ZT-T Thermal Tape | TC + peel adhesion | Bonds and conducts heat in one step |
| Power transistor / module needing isolation | ZT-I Insulating Sheet | Dielectric strength | Combines heat transfer with electrical isolation |
Send us your application drawing, operating temperature range and clearance tolerance — our engineering team will recommend the right Zyrmet material family and grade.