Every material is qualified, batch-tested, and stocked in India — engineered to the application rather than sold off the shelf.
Solid and semi-solid pads that fill the gap between a heat-generating component and a he…
Two-part, form-in-place liquids for complex geometries and automated dispensing — the st…
Paste-form compounds for CPU, GPU, and IGBT-to-heatsink contact where a thin, low-resist…
Solid at rest, flowing only at operating temperature — replacing grease with zero pump-o…
Double-sided conductive tapes and bonding films for LED attachment, heatsink bonding, an…
A quick-reference starting point — our engineering team will confirm the exact grade against your drawing.
| Application Need | Recommended Family | Key Spec to Verify | Why This Family |
|---|---|---|---|
| Flat CPU / power module to heat sink, thin bond line | ZTG Pro | Thermal conductivity + bleed resistance | Best contact on flat, low-tolerance surfaces |
| EV battery cell-to-module gap, large clearance | ZGF Core / ZGF Pro | Thermal conductivity + dispensed viscosity | Fills irregular geometry via automated dispensing |
| CPU / GPU replacing grease, no pump-out risk | ZPC Core / ZPC UltraThin | Phase transition temperature | Solid at rest, flows only under operating heat |
| LED chip to heat sink, light mechanical load | ZTT Core | Thermal conductivity + peel adhesion | Bonds and conducts heat in one step |
| Power transistor / module needing isolation | ZTP Shield | Dielectric strength | Combines heat transfer with electrical isolation |
| Permanent heatsink bonding, high-pressure assembly | ZTT Bond | Adhesion strength + operating temperature | Structural bond replaces mechanical fasteners |
Operating temperature range, clearance tolerance, and mounting method are usually all we need to recommend a starting grade.